Category: electronics
Reported in Scientific America, March 7, 2010
By: Tina Casey
A team of researchers at Yale University has developed a new kind of magnetic, lead free solder that could be used to manufacture electronics more cheaply and efficiently.
Published in MIT Technology Review, March 5, 2010
The lead-free material may make it easier and cheaper to make "stacked" chips with more computing power.
A new type of solder can be melted and shaped in three dimensions under the force of a weak magnetic field.
New Haven, Conn. — Yale University scientists have developed a magnetic solder that can be manipulated in three dimensions and selectively heated, and offers a more environmentally friendly alternative to today’s lead-based solders.
The United States is in an energy crisis, prompting power companies to look for young engineers to help solve this crisis.
Leading nanoscientist Paul S.
A new method for device fabrication, published online in the January 29, 2009, issue of Applied Physics Letters, allows for submicron resolution patterning
Professor Chad Mirkin, director of Northwestern University's International Institute for Nanotechnology, has been awarded the 2009 $500,000 Lemelson-MIT Prize for innovations that have the potential to transform the future of medical diagnostics and patient point-of-care and to ignite change across
Nanoelectromechanical systems (NEMS) devices have the potential to revolutionize the world of sensors: motion, chemical, temperature, etc. But taking electromechanical devices from the micro scale down to the nano requires finding a means to dissipate the heat output of this tiny gadgetry.
A study of stickers peeling from windows could lead to a new way to precisely control the fabrication of stretchable electronics, according to a team of researchers including one at MIT.
Stretchable electronics, which would enable electronic devices embedded into clothing, surgical gloves, electro
James L. Easton, chairman and CEO of sports equipment company Jas. D. Easton Inc., has given $2 million to the UCLA Henry Samueli School of Engineering and Applied Science to fund research on advanced carbon materials for sports equipment and aerospace applications.
